Modern electronic design automation (EDA) is a powerful tool for EE /RF/ microwave engineers, but these tools do not address 3D electromagnetic (EM) field radiation, crosstalk and interference which plays a critical role at high frequencies and high data rates. This technically challenging aspect has typically been addressed by electromagnetic compatibility (EMC) testing in the laboratory – or with complex numerically-meshed models by specialist simulation engineers that take weeks to build and solve, and do not account for statistical uncertainty. Each of these typically occur too late to participate in the up-front EDA design process, particularly when considering the system-level integration of multiple components and subsystems which have complex interacting 3D EM fields on a full aerospace vehicle platform.

Enter new mesh-free wave physics modeling, which innovatively exploits the chaos of wave scattering in complex 3D EM fields, to define a statistically reduced order model which is typically 1,000x simpler and faster to solve. This disruptive technology is fast enough to ensure 3D EM field physics can be included in the up-front EDA design process. The application software solves interactively in seconds or minutes on a standard Windows laptop or desktop computer, even for system-level EM field coupling application to a full aerospace vehicle platform. Unlike numerical meshing simulation codes, the wave formulated model’s solve time is the same for 1 GHz, 18 GHz and 40 GHz.

So how can it possibly be one thousand times simpler and faster - how does it work? It works in four simple steps. First, the scattered 3D wave physics problem is transformed to a volume integrated energy variable, from which the principle of power balance can be used to predict the statistical mean-squared E field response levels, in multiple connected zones. Second, the chaotic scattering within each field energy zone has a physics-based asymptotic probability density function that predicts the maximum and minimum E field variance around the mean square level in each zone. Third, the radiation coupling of chaotic E field coupling to and from the current on printed circuit boards, cables, connectors and component subsystems can be reduced to closed form analytical models. And finally the complex 3D EM field induced crosstalk and interference is predicted versus time or frequency, using only the known / predictable statistical limits of E fields, voltages and currents.

This is a disruptive technology offering huge benefits in multiple markets sectors. Examples include EDA design for safety standards compliance - slashing the $5+ billion spent each year on EMC testing. Enabling new solutions for voltage noise limited signal integrity in the $100+ billion high speed digital interconnect market. Simulation-based design solutions for higher throughput, higher reliability and lower latency wireless comms performance in the $300+ billion 5G/6G market worldwide. And simulation based design of reduced fading and increased throughput of distributed router / antenna / repeater systems in the $30+ billion wifi router market worldwide.