Synergy PAC

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Synergy PAC — A Modular Redundant Process Automation Controller

The Synergy PAC is a next-generation process automation controller that blends the flexibility of a PAC with the robustness and fault tolerance of safety-critical systems. Engineered for high-reliability industrial and embedded environments, Synergy PAC introduces a modular control architecture based on triple-redundant processing, distributed analog I/O, and an optically-coupled bus system—all within a form factor compatible with standard DIN rail installations.

At its core is the Synergy PAC CPU module, which integrates four octa-core ARM processors. Three operate in active lockstep for deterministic control, while a fourth, supervisory processor monitors the system and manages diagnostic and commissioning functions. Redundant, high-precision watchdog timers oversee both local and peer processor states, enabling real-time fault detection and failover by voting out malfunctioning units. Each PAC processor includes 2 GB SRAM and 4 GB flash memory; the supervisory core provides 8 GB RAM, 16 GB flash, and access to 80 GB of system-wide flash storage, with further expansion via microSD.

The system’s optical backplane enables high-speed, interference-free communications across eight optical channels: three for I/O synchronization, three for network data, and two reserved for system failover. Each module contains sealed optical windows and power pass-through contacts, forming a self-aligning, contaminant-resistant bus when locked in place. This eliminates the need for a separate backplane chassis and simplifies modular expansion.

Redundant power converters support universal voltage input from 12 to 240 VAC/VDC, and passive cooling enables reliable operation in thermally constrained environments. Front-panel LCDs offer configurable status displays, while secure access to commissioning tools is provided via an onboard web interface, Bluetooth, and Wi-Fi.

Synergy PAC supports up to 16.7 million discrete I/O points and over 65,000 analog I/O points, all of which are software-configurable and fully isolated. All standard I/O modules use analog channels for both digital and analog signals, enabling advanced diagnostics such as partial failure detection, contact bounce analysis, and input impedance checks not possible with conventional digital I/O. High-speed I/O, frequency counters, resolver inputs, and motor drivers are handled by attachable I/O extension modules, allowing tailored expansion without sacrificing redundancy or signal integrity.

Each I/O channel is individually monitored, optically isolated, and can be assigned to processor-specific redundancy groups for load balancing or failover. Integrated “kill switches” can isolate faulty channels on-the-fly, maintaining system continuity even under partial I/O failure.

Manufacturing of Synergy PAC relies entirely on established industry practices, including standard PCB fabrication, injection-molded enclosures, and commercial off-the-shelf components. ROHS compliance is maintained across the design. Specialized elements such as optical transceiver windows and modular seals are built using conventional fiber and plastics processing methods, ensuring cost-effective, scalable production.

Synergy PAC represents a durable, scalable control platform designed to meet the demands of tomorrow’s connected, safety-critical automation environments—with built-in resilience, field-level flexibility, and no exotic hardware dependencies.

Synergy PAC is ideal for smart manufacturing, critical infrastructure, and autonomous systems where uptime, diagnostic precision, and secure control integration are non-negotiable.

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  • About the Entrant

  • Name:
    Mark Bunds
  • Type of entry:
    individual
  • Software used for this entry:
    Keil MDK, ARM Development Studio (DS-5), SEGGER, PlatformIO, QNX Neutrino RTOS, Buildroot / Yocto, CMSIS/OpenOCD, Comms Protocol Libraries, TPM2 Software Stack, Mbed TLS / wolfSSL, Altium Designer, Autodesk Inventor/Showcase.
  • Patent status:
    none