I can 3D-print my passive devices SFGs so they can withstand 220C and I can place them in between the large fans and the heat sink. The additional multi-scale cooling will help the fans overall efficiency and will produce lower decibels of sound.
Dell RTX 3060 Ti
Nvidia Goforce RTX 40 series, 30 series
Additional applications include cases and process chips
My company has patented a Fractal Orifice Plate US9278362. This passive device replaces (Euclidean geometry) standard grid structures that are currently used in the cooling of semiconductor chips.
Bespoke (customized) turbulence refers to:
- Turbulent flows generated or influenced by multiscale/fractal structures
- These structures are passive no additional energy is required
- The turbulent flows can be increased by up to 420% of standard grid flows based on a formula
- The peak turbulence of a turbulent flow can be moved away from the grid by some distance based on a formula
Bespoke Turbulence Effects
- Turbulent mixing and diffusion, efficient heat exchange, enhanced ventilation
- Fractal Grids greatly enhance mixing and diffusivities compared to regular grids
- In pipes FG's are more efficient in pressure drop and reduced disturbance of flow
Research and United States Patent Protection valid till 2032
Imperial College London has done most of the basic research and descriptions of the formula and terms of the concepts of "Fractal Flow" and my small company has a US patent US9278362 that places fractal geometry at the end of a pipe or conduit.
Potential Applications Graphic and Game Cards include but not limited to:
- Dell RTX 3060 Ti
- Nvidia Goforce RTX 40 series, 30 series
- Additional applications include cases and process chips
The initial study showing high Reynolds number turbulence was Hurst and Vassilicos (2007). Subsequent work includes Secoud and Vassilicos (2007), Mazellier and Vassilicos (2010) and Nagata et al. (2008a, 2013). Additionally Professors Vassilicos and Sakai edited the 2016 book: Fractal Flow Design: How to Design Bespoke Turbulence and Why.
Heat transfer studies include: Cafiero (2017) (Chew 2021) and others, with electronics cooling mentioned in the research studies.