At DTL Chemical, we didn’t just solve the heat problem, we redefined how thermal conductivity of 270 W/M*K at 50% of current cost will work for future silicon.

As artificial intelligence drives the rise of custom silicon, today’s chips are becoming smaller, faster, and more powerful than ever. But with that leap in performance comes a major challenge: heat. Managing it effectively is essential for maintaining system stability and unlocking maximum performance from the silicon.

At DTL Chemical, we developed an innovative solution—customized Thermal Interface Material (TIM) pads built on a precision-engineered lattice. Each layer features spatial gradations of: Copper for conductivity, Fillers for structural strength, and Indium for malleability, and incorporates an aerospace-grade heat dissipation chemical to enhance thermal performance.

What makes our approach unique is the ability to tailor each pad to match a chip’s specific thermal hotspots. Our material isn’t just stacked—it’s spatially mapped and layered to move heat both vertically and horizontally across the TIM pad. This targeted control enables efficient heat dissipation even under the most demanding workloads.

The result? A thermal solution built around the chip—not the other way around. It boosts reliability, extends component life, and scales effortlessly across a wide range of architectures, from AI accelerators to custom silicon designs.