A new approach for enhancing joints’ properties based on the epoxysiliconorganic glue by simultaneously integrating micro- and nanosized fillers into a glue formulation has been proposed. It has been revealed that it results in a more than threefold increase in the glue joint’s thermoresistability.
The toughness of the found glue seam structure should raise compared with the standard formulation due to the fact that nanoparticles tend to fill the free space between microparticles of the typical microfiller.
Fig. 1 (a,b) illustrates how micro- and nanoparticles may increase the toughness of a glue seam when simultaneously introduced into a glue formulation.