Improved Temperature Compensation for Wireless Communications

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Typical temperature compensation techniques for wireless communications add ~$1 per oscillator, reduces battery life and reliability. Based on current experiments and patents granted, we can establish tighter frequency control while removing the added cost and complexity in the circuitry commonly used in cellular and other wireless applications. By adjusting the quarts cut away from the AT angle area, we adjust the effective stiffness of the hemihedral crystalline structure so that its third order temperature coefficent is lower than the the industry standard AT cut. Prior efforts in this area led by Seico with the GT cut have produced technical performance but are not inherently mass producible due to the nature of the acoustic wave which is an extensional mode and thus both difficult to mount and highly subject to shock damage. Our cuts are a type of shear mode, thus taking advantage of the current industry infrastructure with regards to manufacturability.

We envision two approaches to product lines: one wherein standard performance is gained but due to lower temperature compensation requirements, the cost of the oscillator is reduced and battery life is extended. Secondly, we envision a product line wherein tighter frequency control is achieved at the same cost as cost as lower performance oscillators. The current market consumes many hundred millions of these types of oscillators every year. Due to my contacts in Qualcomm, I have recieved an example copy of the specifications to which they would prefer to purchase oscillators and temperature compensation along with the qualification protocols needed before committing to an engineering procurement and larger scale purchases.


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  • Name:
    Mark Branham
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    Mathcad, Pro E.
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    Weightlifting, Chess
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    Discovery of the explanations of new phenomena.
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