Peel Off Wafer Electronic Resting (POWER) Technology

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Electronics
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Printed Circuit Board (PCB) mounting technologies have been improving continuously parallel with the advent of new advanced components up to the level of Surface Mounting Devices (SMD) and the technology is itself called Surface Mounting Technology (SMT). However, not much emphasis have been shown by the developers in line with the perspective of the repair and the maintenance personnel. The impact of that negligence has contributed negatively in several ways such that scarcity of repair and maintenance jobs, creation of bulk quantities of electronics waste which in turn causing huge environomental problems, loss of value of entire purchase of electronics goods since failing of one crucial component requires replacement of the whole main board (in case of computer, whole motherboard). Being a repair and maintenance personnel myself, I have been watching these scenarios with despair (not being able to repair) and pity, and therefore, incidentally have come up to some novel ideas which could improve the situation if adopted by electronics manufacturers.

I shall putup my idea as an example for the mother of all electronics components, that is the "Microprocessor", but the technique could be adopted for any active or passive electronic component whatsoever with equal success excluding some sensitive Radio Frequency (RF) Circuitry, where soldering of the components to the PCB is essential due to unavoidable technical reasons.

I call this new mounting technology "Peel Off Wafer Electronic Resting" (POWER) mounting technology. The following nomenclature shall elaborate the scheme:
1) Component on top, here for example the "microprocessor"
2) A double sided PCB wafer with through connected holes (Note: This is the simplest form of the wafer only for the sake of explanation, however several other techniques could be adopted as per situation and the requirements of the device under development, just for instance, following type of wafers could also be implemented:
i) Tiny gold coated aluminum balls sandwiched between two fibre sheets in such a way that the balls' upper and lower portion touches the microprocessor on the upper side and to the motherboard at the lower side,
ii) Tiny gold coated pins with round half spherical heads and spring inside, again sandwiched between two fibre wafers,
iii) A wafer of sheet of insulated rubber preferably of silicone with tiny conducting carbon or other conductive material suitable to the device and environment, sandwiched between processor and motherboard, etc.
3) Mainboard on down, here for example "Computer Motherboard," being in line to the "Microprocessor."

With the above nomenclature in mind, following manfacturing details about components and mainboard must be followed:
1) Each component shall be manufactured according to industrial standard of a specific size so that it could be put on the wafer according to a particular notch made on wafer.
2) Components shall be manufactured with edges, like in Lithium Ion Batteries and in latest Microprocessors, and not with leads.
3) Small components could be glued between wafer and mainboard while large components like microprocessor, could be ZIF socketed as normal.

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  • ABOUT THE ENTRANT

  • Name:
    Liaquat Ali
  • Type of entry:
    individual
  • Profession:
    I & C Supervisor
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