Manufacturing & Materials
Existing three-dimensional (3D) printing technologies, whether polymer-based or metal-based, can only produce only-plastic structures or only-metal structures, which severely limits the application of additive manufacturing technologies (AM) in electronics such as IOT, ICT, and robotics.
This design idea solves the problems of heavy weight and costs in aircraft and vehicle systems design and manufacturing by eliminating thousands of feet of copper wire that power and connect various systems, most EMI, and time and costs with less additive steps of manufacturing.
Thermally Conductive Encapsulant for Excellent Process-ability and Productivity Improvement of Power Electronics of xEV
DOWSIL™ TC-6032 Thermally conductive encapsulant affects manufacturing key parts of FCEV and BEV and acceleration of new clean energy era by providing excellent process-ability and productivity improvement with higher thermal conductivity around 3.0 W/m·K and lower viscosity around 6,500 mPa·s,
This is a concept that includes a manufacturing process in the construction and assembly of multiple rows and multiple tubes in face of Heat Pipes. The introduction of stamped obstructions in the airflow and the heat transfer rate increases as opposed to no induced obstructions.
Most of the world’s power is generated at centralized locations (power plants, wind or solar farms, etc.) and then must be transmitted over cables at high voltage (HV) to minimize electrical losses.
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